咨詢熱線
13916855175
13916855175
產品分類
Product Category相關文章
Related Articles詳細介紹
等離子體去膠機（高性價比）
儀器應用：
Isotropic dry etching of polymer (photo resist)
Cleaning of silicon (or glass) wafer surface
Removal of native oxide on wafer
等離子體去膠機（高性價比）技術參數：
Sample size & throughput : 4 ~ 8inch, Single wafer
RF power : 600W @13.56MHz, Auto matching control
Substrate chuck : Heating or Cooling available (selectable)
Process gas : O2, CF4 ,Ar, N2
Gas supply method : Showerhead type
Ultimate pressure : ≤ 5×10-3Torr
Vacuum pump : Rotary pump
Process control : Auto process control (PLC)
常用工藝參數：
Photoresist Etch
| gas | 100% O2 |
| operating pressure | 100 millitorr |
| power level | 100 watts |
| etch rate | 997 angstroms/min |
| uniformity | +/- 5% |
Nitride Etch
| gas | 95% CF4 / 5% O2 |
| operating pressure | 100 millitorr |
| power level | 100 watts |
| etch rate | 450 angstroms/min |
| uniformity | +/- 5% |
BiPolar Silicon Glass (BPSG) Etch
| gas | 95% CF4 / 5% O2 |
| operating pressure | 100 millitorr |
| power level | 100 watts |
| etch rate | 520 angstroms/min |
| uniformity | +/- 5% |
PolySilicon Glass (PSG) Etch
| gas | 95% CF4 / 5% O2 |
| operating pressure | 100 millitorr |
| power level | 100 watts |
| etch rate | 450 angstroms/min |
| uniformity | +/- 5% |
Oxide Etch (SiO2)
| gas | 95% CF4 / 5% O2 |
| operating pressure | 100 millitorr |
| power level | 100 watts |
| etch rate | 200 angstroms/min |
| uniformity | +/- 10% |
Aluminum Etch*
| gas | 80% BCl3 /20% Cl2 |
| operating pressure | 150 millitorr |
| power level | 150 watts |
| etch rate | 200 angstroms/min |
| uniformity | +/- 5% |
產品咨詢
掃一掃，關注微信電話
微信掃一掃
當前位置：
